Capable of coping with a request for high speed. ( Max. 2,500 / sec )
High acceleration capacity and larger uniform speed section available.
Chip mounter
Bonding and chip mounting on circuit board.
Electronic part mounting process.
Double carrier structure enabled compact size.
Layout design is easy as different workpieces can be carried onto the same axis.
Clean specification requirement can be coped with easily.
Check device
Handling to multiple number of check devices.
2 heads can be installed to the same axis compactly.
High speed operation.
Open / close device
Wide open/close of shutter.
It is possible to drive a work with a large width ( shutter ) using the dual drive method.
Various advantages ( such as center layout, higher open / close speed, sharing of effective stroke ) are available due to adoption of the double carrier mechanism.
Driving with the dual drive mechanism is available by placing 2 units of double carrier phasers in parallel and fixing them with sliders respectively.
